お見積

サンプルお申込み

お問い合わせ

今すぐ購入

※ご注文方法：お問い合わせフォームまたはメールにてご連絡ください。
支払方法：「銀行振込」の場合， 注文の確認後、ご指定のメールアドレスに電子版の請求書をお送りいたしますので、電子版の請求書の記載事項に従って送金操作を行ってください。
※納期：原則として、受注後2～4営業日以内に発送いたします。 但し、日本語版が必要な場合は、受注後8～10営業日となります。 お客様のニーズに合わせて、事前にご注文のスケジュールをお立てください。

本報告書は、炭化ケイ素ウェーハレーザー切断装置の世界市場、容量、生産量、収益、価格の概要を紹介します。2020~2024年の歴史的な市場収益/売上データ、2025年の予想、および2031年までのCAGRの予測を含む世界市場動向の分析。本レポートはメーカー、地域、製品の種類と端末業界の角度から世界と主要地域の市場現状と将来性を研究した、このレポートでは、世界と主要地域のトップメーカーを分析し、製品タイプとアプリケーション/端末業界別に炭化ケイ素ウェーハレーザー切断装置市場を分類しています。
本レポートでは世界の炭化ケイ素ウェーハレーザー切断装置市場の主な参加者として、企業概要、販売数量、収益、価格、粗利益率、ポートフォリオ、地理的位置、重要な発展を次のパラメータに基づいて紹介します。本研究に含まれる主な企業は：DISCO Corporation、Suzhou Delphi Laser Co、Han's Laser Technology、3D-Micromac、Synova S.A.、HGTECH、ASMPT、GHN.GIE、Wuhan DR Laser Technology

レポートは炭化ケイ素ウェーハレーザー切断装置の主要生産者を調査し、主要地域や国の消費状況も提供します。炭化ケイ素ウェーハレーザー切断装置の今後の市場の可能性のハイライト、およびこの市場をさまざまなセグメントおよびサブセグメントに予測するための主要な地域/国の焦点。アメリカとカナダ、中国、アジア、ヨーロッパ、中東、アフリカ、ラテンアメリカ、およびその他の国の国別データと市場価値分析。

2020年から2031年までのタイプ別および用途別、売上高、収益、価格別のセグメントデータを分析します。
タイプ別市場セグメント：
    Processing Sizes up to 6 Inches
    Processing Sizes up to 8 Inches

用途別の市場セグメント：
    Foundry
    IDM

本レポートの詳細内容
本レポートは、世界の炭化ケイ素ウェーハレーザー切断装置市場の現状と将来展望を包括的に分析し、グローバルの主要地域における開発動向の綿密な調査を通じて、読者に包括的な市場分析を提示するものであります。市場の全体像を把握するために、プレイヤー、地域、製品タイプ、最終産業を網羅した多角的な分析を提供しています。さらに、世界市場のトッププレイヤーを特定し、プロファイルを作成するとともに、製品タイプや用途/最終産業に基づいて炭化ケイ素ウェーハレーザー切断装置市場を細分化しています。この分類と応用により、市場の構造とダイナミクスをより深く理解することができ、情報に基づいた意思決定と戦略立案が可能になります。
一. 生産面では、2020年から2025年まで、そして2031年までの予測として、メーカー別、地域別（地域レベル、国レベル）の炭化ケイ素ウェーハレーザー切断装置生産量、成長率、市場シェアを調査している。

二. 消費面では、炭化ケイ素ウェーハレーザー切断装置の売上高を地域別（地域レベル・国レベル）、企業別、種類別、用途別に焦点を当てています。2020年から2025年まで、2031年までの予測。

三.主要メーカーの炭化ケイ素ウェーハレーザー切断装置売上高、収益、市場シェア、業界ランキング、2020年から2025年までのデータに焦点を当てています。世界の炭化ケイ素ウェーハレーザー切断装置市場における主要なステークホルダーの特定、最近の動向とセグメント収益に基づいて競争状況と市場ポジショニングの分析。

四.本炭化ケイ素ウェーハレーザー切断装置のレポートでは関係者が市場の競争状況を包括的に理解し、事業戦略や市場戦略を的確に立てるのに役立つ洞察を提供することを目的としています。 売上高、成長動向、生産技術、用途、エンドユーザー産業の市場規模に関する詳細な評価と予測を提供し、意思決定者に強力なデータサポートを提供します。

章の概要
第1章：炭化ケイ素ウェーハレーザー切断装置のレポート範囲、各市場セグメントの市場規模、将来の開発可能性などを含む、さまざまな市場セグメントのエグゼクティブサマリー（タイプ別およびアプリケーション別など）を紹介します。市場の現状と、短期から中期、および長期的な進化の可能性を高度に見ることができます。（2020～2031）
第2章： 炭化ケイ素ウェーハレーザー切断装置の世界と主要生産者（地域／国）の生産／アウトプット。各生産者の生産量と今後6年間の発展可能性を定量的に分析しています。（2020～2031）
第3章：世界、地域、国レベルにおける炭化ケイ素ウェーハレーザー切断装置の売上（消費）、収益。各地域とその主要国の市場規模と発展の可能性を定量的に分析し、世界の各国の市場発展、将来の発展の見通し、市場空間を紹介します。（2020～2031）
第4章炭化ケイ素ウェーハレーザー切断装置メーカーの競争状況、価格、売上高、収益、市場シェアと業界ランキング、最新の開発計画、合併、買収情報などの詳細分析。（2020～2025）
第5章：炭化ケイ素ウェーハレーザー切断装置の各市場セグメントの売上高、収益、平均価格、および開発可能性をカバーした種類別のさまざまな市場セグメントの分析を提供し、読者がさまざまな市場セグメントでブルーオーシャン市場を見つけるのに役立ちます。（2020～2031）
第6章：アプリケーション別の様々な市場セグメントの分析を提供し、各市場セグメントの売上高、収益、平均価格、発展の可能性をカバーし、読者が異なる下流市場でのブルーオーシャン市場を見つけるのに役立ちます。（2020～2031）
第7章：北米（米国・カナダ）：タイプ別、用途別、国別、セグメント別の売上高、収益。（2020～2031）
第8章：ヨーロッパ：タイプ別、用途別、国別、セグメント別の売上高と収益。（2020～2031）
第9章：中国：タイプ別、アプリケーション別、セグメント別の売上高、収益。（2020～2031）
第10章：アジア（中国を除く）：タイプ別、用途別、地域別、セグメント別の売上高、収益。（2020～2031）
第11章：中東、アフリカ、中南米：タイプ別、用途別、国別、セグメント別の売上高、収益。（2020～2031）
第12章：炭化ケイ素ウェーハレーザー切断装置の主要メーカーの概要を提供し、製品の説明と仕様、炭化ケイ素ウェーハレーザー切断装置の売上高、収益、価格、粗利益率、最近の発展など、市場の主要企業の基本的な状況を詳細に紹介します。（2020～2025）
第13章：産業チェーン、販売チャネル、主要原材料、販売代理店および顧客の分析。
第14章：炭化ケイ素ウェーハレーザー切断装置の市場動態、市場の最新の動向、市場の推進要因と制約要因、業界内のメーカーが直面する課題とリスク、業界内の関連政策の分析を紹介します。
第15章：レポートの要点と結論。

Silicon carbide (SiC) was discovered in 1893 as an industrial abrasive for grinding wheels and automotive brakes. The scheme of laser cutting silicon carbide is laser modified cutting technology. The principle is to use a laser beam with a high transmission wavelength to focus on the inside of the wafer through a lens, and multiphoton absorption occurs, resulting in a local deformation layer, namely modified layer. The layer is mainly composed of holes, high dislocation density layers and cracks. The modified layer is the starting point of subsequent wafer dicing and cracking. The modified layer can be confined inside the wafer by optimizing the laser and optical path system, and no thermal damage is caused to the surface and bottom of the wafer. Then, use external force to guide the cracks to the surface and bottom of the wafer, separating the wafer into the required size.
The global SiC Wafer Laser Cutting Equipment market is projected to grow from US$ 120.7 million in 2024 to US$ 298.4 million by 2030, at a Compound Annual Growth Rate (CAGR) of 16.3% during the forecast period.
Global key players of SiC wafer laser cutting equipment include DISCO Corporation,  SuZhou Delphi Laser and Han's Laser, etc. The top three players hold a share over 60%.From the perspective of consumption value by region，Asia-Pacific (excluding China) is the largest market of SiC wafer laser cutting equipment, followed by China, North America, and Europe. In terms of type, processing sizes up to 6 Inches account for more than 75% of the market share. In terms of application, foundry has a share over 60 %.
In terms of production side, this report researches the SiC Wafer Laser Cutting Equipment production, growth rate, market share by manufacturers and by region (region level and country level), from 2019 to 2024, and forecast to 2030.

In terms of consumption side, this report focuses on the sales of SiC Wafer Laser Cutting Equipment by region (region level and country level), by company, by Type and by Application. from 2019 to 2024 and forecast to 2030.
Report Covers:
This report presents an overview of global market for SiC Wafer Laser Cutting Equipment, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2019 - 2024, estimates for 2024, and projections of CAGR through 2030. 
This report researches the key producers of SiC Wafer Laser Cutting Equipment, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for SiC Wafer Laser Cutting Equipment, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the SiC Wafer Laser Cutting Equipment sales, revenue, market share and industry ranking of main manufacturers, data from 2019 to 2024. Identification of the major stakeholders in the global SiC Wafer Laser Cutting Equipment market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2019 to 2030. Evaluation and forecast the market size for SiC Wafer Laser Cutting Equipment sales, projected growth trends, production technology, application and end-user industry.
Market Segmentation
By Company
    DISCO Corporation
    Suzhou Delphi Laser Co
    Han's Laser Technology
    3D-Micromac
    Synova S.A.
    HGTECH
    ASMPT
    GHN.GIE
    Wuhan DR Laser Technology

Segment by Type
    Processing Sizes up to 6 Inches
    Processing Sizes up to 8 Inches

Segment by Application
    Foundry
    IDM

Production by Region
    North America
    Europe
    China
    Japan

Sales by Region
    US & Canada
        U.S.
        Canada
    China
    Asia (excluding China)
        Japan
        South Korea
        China Taiwan
       Southeast Asia
        India
    Europe
        Germany
        France
        U.K.
        Italy
        Russia
    Latin America, Middle East & Africa
        Brazil
        Mexico
        Turkey
        Israel
        GCC Countries

Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: SiC Wafer Laser Cutting Equipment production/output of global and key producers (regions/countries). It provides a quantitative analysis of the production, and development potential of each producer in the next six years.
Chapter 3: Sales (consumption), revenue of SiC Wafer Laser Cutting Equipment in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 4: Detailed analysis of SiC Wafer Laser Cutting Equipment manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by Type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America (US & Canada) by Type, by Application and by country, sales, and revenue for each segment.
Chapter 8: Europe by Type, by Application and by country, sales, and revenue for each segment.
Chapter 9: China by Type, and by Application, sales, and revenue for each segment.
Chapter 10: Asia (excluding China) by Type, by Application and by region, sales, and revenue for each segment.
Chapter 11: Middle East, Africa, Latin America by Type, by Application and by country, sales, and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, SiC Wafer Laser Cutting Equipment sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.

List of Tables
    Table 1. Global SiC Wafer Laser Cutting Equipment Market Size Growth Rate by Type, 2019 VS 2023 VS 2030 (US$ Million)
    Table 2. Major Manufacturers of Processing Sizes up to 6 Inches
    Table 3. Major Manufacturers of Processing Sizes up to 8 Inches
    Table 4. Global SiC Wafer Laser Cutting Equipment Market Size Growth Rate by Application, 2019 VS 2023 VS 2030 (US$ Million)
    Table 5. Global SiC Wafer Laser Cutting Equipment Production by Region: 2019 VS 2023 VS 2030 (Units)
    Table 6. Global SiC Wafer Laser Cutting Equipment Production by Region (2019-2024) & (Units)
    Table 7. Global SiC Wafer Laser Cutting Equipment Production by Region (2025-2030) & (Units)
    Table 8. Global SiC Wafer Laser Cutting Equipment Production Market Share by Region (2019-2024)
    Table 9. Global SiC Wafer Laser Cutting Equipment Production Market Share by Region (2025-2030)
    Table 10. Global SiC Wafer Laser Cutting Equipment Revenue Grow Rate (CAGR) by Region: 2019 VS 2023 VS 2030 (US$ Million)
    Table 11. Global SiC Wafer Laser Cutting Equipment Revenue by Region (2019-2024) & (US$ Million)
    Table 12. Global SiC Wafer Laser Cutting Equipment Revenue by Region (2025-2030) & (US$ Million)
    Table 13. Global SiC Wafer Laser Cutting Equipment Revenue Market Share by Region (2019-2024)
    Table 14. Global SiC Wafer Laser Cutting Equipment Revenue Market Share by Region (2025-2030)
    Table 15. Global SiC Wafer Laser Cutting Equipment Sales Grow Rate (CAGR) by Region: 2019 VS 2023 VS 2030 (US$ Million)
    Table 16. Global SiC Wafer Laser Cutting Equipment Sales by Region (2019-2024) & (Units)
    Table 17. Global SiC Wafer Laser Cutting Equipment Sales by Region (2025-2030) & (Units)
    Table 18. Global SiC Wafer Laser Cutting Equipment Sales Market Share by Region (2019-2024)
    Table 19. Global SiC Wafer Laser Cutting Equipment Sales Market Share by Region (2025-2030)
    Table 20. Global SiC Wafer Laser Cutting Equipment Sales by Manufacturers (2019-2024) & (Units)
    Table 21. Global SiC Wafer Laser Cutting Equipment Sales Share by Manufacturers (2019-2024)
    Table 22. Global SiC Wafer Laser Cutting Equipment Revenue by Manufacturers (2019-2024) & (US$ Million)
    Table 23. Global SiC Wafer Laser Cutting Equipment Revenue Share by Manufacturers (2019-2024)
    Table 24. SiC Wafer Laser Cutting Equipment Price by Manufacturers 2019-2024 (US$/Unit)
    Table 25. Global Key Players of SiC Wafer Laser Cutting Equipment, Industry Ranking, 2022 VS 2023 VS 2024
    Table 26. Global SiC Wafer Laser Cutting Equipment Manufacturers Market Concentration Ratio (CR5 and HHI)
    Table 27. Global SiC Wafer Laser Cutting Equipment by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in SiC Wafer Laser Cutting Equipment as of 2023)
    Table 28. Global Key Manufacturers of SiC Wafer Laser Cutting Equipment, Manufacturing Base Distribution and Headquarters
    Table 29. Global Key Manufacturers of SiC Wafer Laser Cutting Equipment, Product Offered and Application
    Table 30. Global Key Manufacturers of SiC Wafer Laser Cutting Equipment, Date of Enter into This Industry
    Table 31. Mergers & Acquisitions, Expansion Plans
    Table 32. Global SiC Wafer Laser Cutting Equipment Sales by Type (2019-2024) & (Units)
    Table 33. Global SiC Wafer Laser Cutting Equipment Sales by Type (2025-2030) & (Units)
    Table 34. Global SiC Wafer Laser Cutting Equipment Sales Share by Type (2019-2024)
    Table 35. Global SiC Wafer Laser Cutting Equipment Sales Share by Type (2025-2030)
    Table 36. Global SiC Wafer Laser Cutting Equipment Revenue by Type (2019-2024) & (US$ Million)
    Table 37. Global SiC Wafer Laser Cutting Equipment Revenue by Type (2025-2030) & (US$ Million)
    Table 38. Global SiC Wafer Laser Cutting Equipment Revenue Share by Type (2019-2024)
    Table 39. Global SiC Wafer Laser Cutting Equipment Revenue Share by Type (2025-2030)
    Table 40. SiC Wafer Laser Cutting Equipment Price by Type (2019-2024) & (US$/Unit)
    Table 41. Global SiC Wafer Laser Cutting Equipment Price Forecast by Type (2025-2030) & (US$/Unit)
    Table 42. Global SiC Wafer Laser Cutting Equipment Sales by Application (2019-2024) & (Units)
    Table 43. Global SiC Wafer Laser Cutting Equipment Sales by Application (2025-2030) & (Units)
    Table 44. Global SiC Wafer Laser Cutting Equipment Sales Share by Application (2019-2024)
    Table 45. Global SiC Wafer Laser Cutting Equipment Sales Share by Application (2025-2030)
    Table 46. Global SiC Wafer Laser Cutting Equipment Revenue by Application (2019-2024) & (US$ Million)
    Table 47. Global SiC Wafer Laser Cutting Equipment Revenue by Application (2025-2030) & (US$ Million)
    Table 48. Global SiC Wafer Laser Cutting Equipment Revenue Share by Application (2019-2024)
    Table 49. Global SiC Wafer Laser Cutting Equipment Revenue Share by Application (2025-2030)
    Table 50. SiC Wafer Laser Cutting Equipment Price by Application (2019-2024) & (US$/Unit)
    Table 51. Global SiC Wafer Laser Cutting Equipment Price Forecast by Application (2025-2030) & (US$/Unit)
    Table 52. US & Canada SiC Wafer Laser Cutting Equipment Sales by Type (2019-2024) & (Units)
    Table 53. US & Canada SiC Wafer Laser Cutting Equipment Sales by Type (2025-2030) & (Units)
    Table 54. US & Canada SiC Wafer Laser Cutting Equipment Revenue by Type (2019-2024) & (US$ Million)
    Table 55. US & Canada SiC Wafer Laser Cutting Equipment Revenue by Type (2025-2030) & (US$ Million)
    Table 56. US & Canada SiC Wafer Laser Cutting Equipment Sales by Application (2019-2024) & (Units)
    Table 57. US & Canada SiC Wafer Laser Cutting Equipment Sales by Application (2025-2030) & (Units)
    Table 58. US & Canada SiC Wafer Laser Cutting Equipment Revenue by Application (2019-2024) & (US$ Million)
    Table 59. US & Canada SiC Wafer Laser Cutting Equipment Revenue by Application (2025-2030) & (US$ Million)
    Table 60. US & Canada SiC Wafer Laser Cutting Equipment Revenue Grow Rate (CAGR) by Country: 2019 VS 2023 VS 2030 (US$ Million)
    Table 61. US & Canada SiC Wafer Laser Cutting Equipment Revenue by Country (2019-2024) & (US$ Million)
    Table 62. US & Canada SiC Wafer Laser Cutting Equipment Revenue by Country (2025-2030) & (US$ Million)
    Table 63. US & Canada SiC Wafer Laser Cutting Equipment Sales by Country (2019-2024) & (Units)
    Table 64. US & Canada SiC Wafer Laser Cutting Equipment Sales by Country (2025-2030) & (Units)
    Table 65. Europe SiC Wafer Laser Cutting Equipment Sales by Type (2019-2024) & (Units)
    Table 66. Europe SiC Wafer Laser Cutting Equipment Sales by Type (2025-2030) & (Units)
    Table 67. Europe SiC Wafer Laser Cutting Equipment Revenue by Type (2019-2024) & (US$ Million)
    Table 68. Europe SiC Wafer Laser Cutting Equipment Revenue by Type (2025-2030) & (US$ Million)
    Table 69. Europe SiC Wafer Laser Cutting Equipment Sales by Application (2019-2024) & (Units)
    Table 70. Europe SiC Wafer Laser Cutting Equipment Sales by Application (2025-2030) & (Units)
    Table 71. Europe SiC Wafer Laser Cutting Equipment Revenue by Application (2019-2024) & (US$ Million)
    Table 72. Europe SiC Wafer Laser Cutting Equipment Revenue by Application (2025-2030) & (US$ Million)
    Table 73. Europe SiC Wafer Laser Cutting Equipment Revenue Grow Rate (CAGR) by Country: 2019 VS 2023 VS 2030 (US$ Million)
    Table 74. Europe SiC Wafer Laser Cutting Equipment Revenue by Country (2019-2024) & (US$ Million)
    Table 75. Europe SiC Wafer Laser Cutting Equipment Revenue by Country (2025-2030) & (US$ Million)
    Table 76. Europe SiC Wafer Laser Cutting Equipment Sales by Country (2019-2024) & (Units)
    Table 77. Europe SiC Wafer Laser Cutting Equipment Sales by Country (2025-2030) & (Units)
    Table 78. China SiC Wafer Laser Cutting Equipment Sales by Type (2019-2024) & (Units)
    Table 79. China SiC Wafer Laser Cutting Equipment Sales by Type (2025-2030) & (Units)
    Table 80. China SiC Wafer Laser Cutting Equipment Revenue by Type (2019-2024) & (US$ Million)
    Table 81. China SiC Wafer Laser Cutting Equipment Revenue by Type (2025-2030) & (US$ Million)
    Table 82. China SiC Wafer Laser Cutting Equipment Sales by Application (2019-2024) & (Units)
    Table 83. China SiC Wafer Laser Cutting Equipment Sales by Application (2025-2030) & (Units)
    Table 84. China SiC Wafer Laser Cutting Equipment Revenue by Application (2019-2024) & (US$ Million)
    Table 85. China SiC Wafer Laser Cutting Equipment Revenue by Application (2025-2030) & (US$ Million)
    Table 86. Asia SiC Wafer Laser Cutting Equipment Sales by Type (2019-2024) & (Units)
    Table 87. Asia SiC Wafer Laser Cutting Equipment Sales by Type (2025-2030) & (Units)
    Table 88. Asia SiC Wafer Laser Cutting Equipment Revenue by Type (2019-2024) & (US$ Million)
    Table 89. Asia SiC Wafer Laser Cutting Equipment Revenue by Type (2025-2030) & (US$ Million)
    Table 90. Asia SiC Wafer Laser Cutting Equipment Sales by Application (2019-2024) & (Units)
    Table 91. Asia SiC Wafer Laser Cutting Equipment Sales by Application (2025-2030) & (Units)
    Table 92. Asia SiC Wafer Laser Cutting Equipment Revenue by Application (2019-2024) & (US$ Million)
    Table 93. Asia SiC Wafer Laser Cutting Equipment Revenue by Application (2025-2030) & (US$ Million)
    Table 94. Asia SiC Wafer Laser Cutting Equipment Revenue Grow Rate (CAGR) by Country: 2019 VS 2023 VS 2030 (US$ Million)
    Table 95. Asia SiC Wafer Laser Cutting Equipment Revenue by Region (2019-2024) & (US$ Million)
    Table 96. Asia SiC Wafer Laser Cutting Equipment Revenue by Region (2025-2030) & (US$ Million)
    Table 97. Asia SiC Wafer Laser Cutting Equipment Sales by Region (2019-2024) & (Units)
    Table 98. Asia SiC Wafer Laser Cutting Equipment Sales by Region (2025-2030) & (Units)
    Table 99. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Sales by Type (2019-2024) & (Units)
    Table 100. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Sales by Type (2025-2030) & (Units)
    Table 101. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Revenue by Type (2019-2024) & (US$ Million)
    Table 102. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Revenue by Type (2025-2030) & (US$ Million)
    Table 103. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Sales by Application (2019-2024) & (Units)
    Table 104. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Sales by Application (2025-2030) & (Units)
    Table 105. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Revenue by Application (2019-2024) & (US$ Million)
    Table 106. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Revenue by Application (2025-2030) & (US$ Million)
    Table 107. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Revenue Grow Rate (CAGR) by Country: 2019 VS 2023 VS 2030 (US$ Million)
    Table 108. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Revenue by Country (2019-2024) & (US$ Million)
    Table 109. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Revenue by Country (2025-2030) & (US$ Million)
    Table 110. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Sales by Country (2019-2024) & (Units)
    Table 111. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Sales by Country (2025-2030) & (Units)
    Table 112. DISCO Corporation Company Information
    Table 113. DISCO Corporation Description and Major Businesses
    Table 114. DISCO Corporation SiC Wafer Laser Cutting Equipment Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 115. DISCO Corporation SiC Wafer Laser Cutting Equipment Product Model Numbers, Pictures, Descriptions and Specifications
    Table 116. DISCO Corporation Recent Development
    Table 117. Suzhou Delphi Laser Co Company Information
    Table 118. Suzhou Delphi Laser Co Description and Major Businesses
    Table 119. Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 120. Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Product Model Numbers, Pictures, Descriptions and Specifications
    Table 121. Suzhou Delphi Laser Co Recent Development
    Table 122. Han's Laser Technology Company Information
    Table 123. Han's Laser Technology Description and Major Businesses
    Table 124. Han's Laser Technology SiC Wafer Laser Cutting Equipment Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 125. Han's Laser Technology SiC Wafer Laser Cutting Equipment Product Model Numbers, Pictures, Descriptions and Specifications
    Table 126. Han's Laser Technology Recent Development
    Table 127. 3D-Micromac Company Information
    Table 128. 3D-Micromac Description and Major Businesses
    Table 129. 3D-Micromac SiC Wafer Laser Cutting Equipment Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 130. 3D-Micromac SiC Wafer Laser Cutting Equipment Product Model Numbers, Pictures, Descriptions and Specifications
    Table 131. 3D-Micromac Recent Development
    Table 132. Synova S.A. Company Information
    Table 133. Synova S.A. Description and Major Businesses
    Table 134. Synova S.A. SiC Wafer Laser Cutting Equipment Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 135. Synova S.A. SiC Wafer Laser Cutting Equipment Product Model Numbers, Pictures, Descriptions and Specifications
    Table 136. Synova S.A. Recent Development
    Table 137. HGTECH Company Information
    Table 138. HGTECH Description and Major Businesses
    Table 139. HGTECH SiC Wafer Laser Cutting Equipment Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 140. HGTECH SiC Wafer Laser Cutting Equipment Product Model Numbers, Pictures, Descriptions and Specifications
    Table 141. HGTECH Recent Development
    Table 142. ASMPT Company Information
    Table 143. ASMPT Description and Major Businesses
    Table 144. ASMPT SiC Wafer Laser Cutting Equipment Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 145. ASMPT SiC Wafer Laser Cutting Equipment Product Model Numbers, Pictures, Descriptions and Specifications
    Table 146. ASMPT Recent Development
    Table 147. GHN.GIE Company Information
    Table 148. GHN.GIE Description and Major Businesses
    Table 149. GHN.GIE SiC Wafer Laser Cutting Equipment Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 150. GHN.GIE SiC Wafer Laser Cutting Equipment Product Model Numbers, Pictures, Descriptions and Specifications
    Table 151. GHN.GIE Recent Development
    Table 152. Wuhan DR Laser Technology Company Information
    Table 153. Wuhan DR Laser Technology Description and Major Businesses
    Table 154. Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 155. Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Product Model Numbers, Pictures, Descriptions and Specifications
    Table 156. Wuhan DR Laser Technology Recent Development
    Table 157. Key Raw Materials Lists
    Table 158. Raw Materials Key Suppliers Lists
    Table 159. SiC Wafer Laser Cutting Equipment Distributors List
    Table 160. SiC Wafer Laser Cutting Equipment Customers List
    Table 161. SiC Wafer Laser Cutting Equipment Market Trends
    Table 162. SiC Wafer Laser Cutting Equipment Market Drivers
    Table 163. SiC Wafer Laser Cutting Equipment Market Challenges
    Table 164. SiC Wafer Laser Cutting Equipment Market Restraints
    Table 165. Research Programs/Design for This Report
    Table 166. Key Data Information from Secondary Sources
    Table 167. Key Data Information from Primary Sources
List of Figures
    Figure 1. SiC Wafer Laser Cutting Equipment Product Picture
    Figure 2. Global SiC Wafer Laser Cutting Equipment Market Size Growth Rate by Type, 2019 VS 2023 VS 2030 (US$ Million)
    Figure 3. Global SiC Wafer Laser Cutting Equipment Market Share by Type in 2023 & 2030
    Figure 4. Processing Sizes up to 6 Inches Product Picture
    Figure 5. Processing Sizes up to 8 Inches Product Picture
    Figure 6. Global SiC Wafer Laser Cutting Equipment Market Size Growth Rate by Application, 2019 VS 2023 VS 2030 (US$ Million)
    Figure 7. Global SiC Wafer Laser Cutting Equipment Market Share by Application in 2023 & 2030
    Figure 8. Foundry
    Figure 9. IDM
    Figure 10. SiC Wafer Laser Cutting Equipment Report Years Considered
    Figure 11. Global SiC Wafer Laser Cutting Equipment Capacity, Production and Utilization (2019-2030) & (Units)
    Figure 12. Global SiC Wafer Laser Cutting Equipment Production Market Share by Region in Percentage: 2023 Versus 2030
    Figure 13. Global SiC Wafer Laser Cutting Equipment Production Market Share by Region (2019-2030)
    Figure 14. SiC Wafer Laser Cutting Equipment Production Growth Rate in North America (2019-2030) & (Units)
    Figure 15. SiC Wafer Laser Cutting Equipment Production Growth Rate in Europe (2019-2030) & (Units)
    Figure 16. SiC Wafer Laser Cutting Equipment Production Growth Rate in China (2019-2030) & (Units)
    Figure 17. SiC Wafer Laser Cutting Equipment Production Growth Rate in Japan (2019-2030) & (Units)
    Figure 18. Global SiC Wafer Laser Cutting Equipment Revenue, (US$ Million), 2019 VS 2023 VS 2030
    Figure 19. Global SiC Wafer Laser Cutting Equipment Revenue 2019-2030 (US$ Million)
    Figure 20. Global SiC Wafer Laser Cutting Equipment Revenue (CAGR) by Region: 2019 VS 2023 VS 2030 (US$ Million)
    Figure 21. Global SiC Wafer Laser Cutting Equipment Revenue Market Share by Region in Percentage: 2023 Versus 2030
    Figure 22. Global SiC Wafer Laser Cutting Equipment Revenue Market Share by Region (2019-2030)
    Figure 23. Global SiC Wafer Laser Cutting Equipment Sales 2019-2030 ((Units)
    Figure 24. Global SiC Wafer Laser Cutting Equipment Sales (CAGR) by Region: 2019 VS 2023 VS 2030 (Units)
    Figure 25. Global SiC Wafer Laser Cutting Equipment Sales Market Share by Region (2019-2030)
    Figure 26. US & Canada SiC Wafer Laser Cutting Equipment Sales YoY (2019-2030) & (Units)
    Figure 27. US & Canada SiC Wafer Laser Cutting Equipment Revenue YoY (2019-2030) & (US$ Million)
    Figure 28. Europe SiC Wafer Laser Cutting Equipment Sales YoY (2019-2030) & (Units)
    Figure 29. Europe SiC Wafer Laser Cutting Equipment Revenue YoY (2019-2030) & (US$ Million)
    Figure 30. China SiC Wafer Laser Cutting Equipment Sales YoY (2019-2030) & (Units)
    Figure 31. China SiC Wafer Laser Cutting Equipment Revenue YoY (2019-2030) & (US$ Million)
    Figure 32. Asia (excluding China) SiC Wafer Laser Cutting Equipment Sales YoY (2019-2030) & (Units)
    Figure 33. Asia (excluding China) SiC Wafer Laser Cutting Equipment Revenue YoY (2019-2030) & (US$ Million)
    Figure 34. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Sales YoY (2019-2030) & (Units)
    Figure 35. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Revenue YoY (2019-2030) & (US$ Million)
    Figure 36. The SiC Wafer Laser Cutting Equipment Market Share of Top 10 and Top 5 Largest Manufacturers Around the World in 2023
    Figure 37. The Top 5 and 10 Largest Manufacturers of SiC Wafer Laser Cutting Equipment in the World: Market Share by SiC Wafer Laser Cutting Equipment Revenue in 2023
    Figure 38. Global SiC Wafer Laser Cutting Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
    Figure 39. Global SiC Wafer Laser Cutting Equipment Sales Market Share by Type (2019-2030)
    Figure 40. Global SiC Wafer Laser Cutting Equipment Revenue Market Share by Type (2019-2030)
    Figure 41. Global SiC Wafer Laser Cutting Equipment Sales Market Share by Application (2019-2030)
    Figure 42. Global SiC Wafer Laser Cutting Equipment Revenue Market Share by Application (2019-2030)
    Figure 43. US & Canada SiC Wafer Laser Cutting Equipment Sales Market Share by Type (2019-2030)
    Figure 44. US & Canada SiC Wafer Laser Cutting Equipment Revenue Market Share by Type (2019-2030)
    Figure 45. US & Canada SiC Wafer Laser Cutting Equipment Sales Market Share by Application (2019-2030)
    Figure 46. US & Canada SiC Wafer Laser Cutting Equipment Revenue Market Share by Application (2019-2030)
    Figure 47. US & Canada SiC Wafer Laser Cutting Equipment Revenue Share by Country (2019-2030)
    Figure 48. US & Canada SiC Wafer Laser Cutting Equipment Sales Share by Country (2019-2030)
    Figure 49. U.S. SiC Wafer Laser Cutting Equipment Revenue (2019-2030) & (US$ Million)
    Figure 50. Canada SiC Wafer Laser Cutting Equipment Revenue (2019-2030) & (US$ Million)
    Figure 51. Europe SiC Wafer Laser Cutting Equipment Sales Market Share by Type (2019-2030)
    Figure 52. Europe SiC Wafer Laser Cutting Equipment Revenue Market Share by Type (2019-2030)
    Figure 53. Europe SiC Wafer Laser Cutting Equipment Sales Market Share by Application (2019-2030)
    Figure 54. Europe SiC Wafer Laser Cutting Equipment Revenue Market Share by Application (2019-2030)
    Figure 55. Europe SiC Wafer Laser Cutting Equipment Revenue Share by Country (2019-2030)
    Figure 56. Europe SiC Wafer Laser Cutting Equipment Sales Share by Country (2019-2030)
    Figure 57. Germany SiC Wafer Laser Cutting Equipment Revenue (2019-2030) & (US$ Million)
    Figure 58. France SiC Wafer Laser Cutting Equipment Revenue (2019-2030) & (US$ Million)
    Figure 59. U.K. SiC Wafer Laser Cutting Equipment Revenue (2019-2030) & (US$ Million)
    Figure 60. Italy SiC Wafer Laser Cutting Equipment Revenue (2019-2030) & (US$ Million)
    Figure 61. Russia SiC Wafer Laser Cutting Equipment Revenue (2019-2030) & (US$ Million)
    Figure 62. China SiC Wafer Laser Cutting Equipment Sales Market Share by Type (2019-2030)
    Figure 63. China SiC Wafer Laser Cutting Equipment Revenue Market Share by Type (2019-2030)
    Figure 64. China SiC Wafer Laser Cutting Equipment Sales Market Share by Application (2019-2030)
    Figure 65. China SiC Wafer Laser Cutting Equipment Revenue Market Share by Application (2019-2030)
    Figure 66. Asia SiC Wafer Laser Cutting Equipment Sales Market Share by Type (2019-2030)
    Figure 67. Asia SiC Wafer Laser Cutting Equipment Revenue Market Share by Type (2019-2030)
    Figure 68. Asia SiC Wafer Laser Cutting Equipment Sales Market Share by Application (2019-2030)
    Figure 69. Asia SiC Wafer Laser Cutting Equipment Revenue Market Share by Application (2019-2030)
    Figure 70. Asia SiC Wafer Laser Cutting Equipment Revenue Share by Region (2019-2030)
    Figure 71. Asia SiC Wafer Laser Cutting Equipment Sales Share by Region (2019-2030)
    Figure 72. Japan SiC Wafer Laser Cutting Equipment Revenue (2019-2030) & (US$ Million)
    Figure 73. South Korea SiC Wafer Laser Cutting Equipment Revenue (2019-2030) & (US$ Million)
    Figure 74. China Taiwan SiC Wafer Laser Cutting Equipment Revenue (2019-2030) & (US$ Million)
    Figure 75. Southeast Asia SiC Wafer Laser Cutting Equipment Revenue (2019-2030) & (US$ Million)
    Figure 76. India SiC Wafer Laser Cutting Equipment Revenue (2019-2030) & (US$ Million)
    Figure 77. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Sales Market Share by Type (2019-2030)
    Figure 78. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Revenue Market Share by Type (2019-2030)
    Figure 79. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Sales Market Share by Application (2019-2030)
    Figure 80. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Revenue Market Share by Application (2019-2030)
    Figure 81. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Revenue Share by Country (2019-2030)
    Figure 82. Middle East, Africa and Latin America SiC Wafer Laser Cutting Equipment Sales Share by Country (2019-2030)
    Figure 83. Brazil SiC Wafer Laser Cutting Equipment Revenue (2019-2030) & (US$ Million)
    Figure 84. Mexico SiC Wafer Laser Cutting Equipment Revenue (2019-2030) & (US$ Million)
    Figure 85. Turkey SiC Wafer Laser Cutting Equipment Revenue (2019-2030) & (US$ Million)
    Figure 86. Israel SiC Wafer Laser Cutting Equipment Revenue (2019-2030) & (US$ Million)
    Figure 87. GCC Countries SiC Wafer Laser Cutting Equipment Revenue (2019-2030) & (US$ Million)
    Figure 88. SiC Wafer Laser Cutting Equipment Value Chain
    Figure 89. SiC Wafer Laser Cutting Equipment Production Process
    Figure 90. Channels of Distribution
    Figure 91. Distributors Profiles
    Figure 92. Bottom-up and Top-down Approaches for This Report
    Figure 93. Data Triangulation
    Figure 94. Key Executives Interviewed